Name: High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor
Brand: SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
SKU: PW-12
Price: 999 USD
Availability: InStock

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High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor

high tensile palladium copper wire

semiconductor bonding wire palladium coated

palladium coated copper wire semiconductor

Lugar de origen:

Porcelana

Nombre de la marca:

WINNER

Certificación:

ISO9100

Número de modelo:

PW-12

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High Tensile Strength Palladium Coated Copper Bonding Wire For Semiconductor

Detalles del producto

Paquete:

Carrete

Acabado superficial:

Brillante

Resistencia a la corrosión:

Alto

Disponibilidad:

Tamaños personalizados disponibles

material:

Cobre

Tipo de producto:

Alambre de unión

Revestimiento:

Palladium

Metros de longitud:

500/1000

Rango de temperatura:

-40 ° C a 200 ° C

Conductividad:

98%

Tamaño del paquete:

100 metros

Fuerza de enlace:

Alto

Resaltar:

high tensile palladium copper wire

semiconductor bonding wire palladium coated

palladium coated copper wire semiconductor

Pago y términos de envío

Cantidad de orden mínima

1 pieza

Precio

999

Detalles de empaquetado

Rollo, embalaje neutrial o con logotipo OEM

Tiempo de entrega

5-8 días laborables

Condiciones de pago

L/C, Western Union, T/T Capacidad de suministro

Capacidad de la fuente

100000 rollos por mes

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Descripción de producto

Palladium Coated Copper Bonding Wire

Palladium Coated Copper Bonding Wire is easier to bond than your standard bare copper wire. The Palladium (Pd) coating allows for high performance and stable bonding, all within a wider bonding. The Pd coating controls the oxidation build up that can occur on the surface of the copper wire.

The Pd coating also extends the Highly Accelerated Stress Test (HAST) reliability. It prevents corrosion of the bonded wire span against halide attack from moulding compounds.

When using PCC bonding wire, you can be sure of excellent reliability, high performance and stable bonding. Ensure to use grounded wire bonding equipment when using PCC bonding wire. Also available in CLR2-2AT, contact our team should you require a quote for this.

Key Advantages

Enhanced bonding performance and stability
Superior oxidation control on copper surface
Extended HAST (Highly Accelerated Stress Test) reliability
Corrosion protection against halide attack from molding compounds
Wider bonding parameter window

Performance Benefits

High bonding reliability is obtained by stable palladium distribution to FAB surface layer
High and stable stitch bondability
Wide bonding window

Application Requirements

For optimal performance, use grounded wire bonding equipment when working with PCC bonding wire. This ensures proper handling and maximizes the benefits of the palladium coating.

Available Options

Also available in CLR2-2AT configuration. Contact our technical team for custom quotes and specific application requirements.

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