Name: Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging
Brand: SICHUAN WINNER SPECIAL ELECTRONIC MATERIALS CO., LTD.
SKU: MW001
Price: 999 USD
Availability: InStock

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Ultrasonic Bonding Gold Wire with Bright Surface Finish for Semiconductor Packaging

Ultrasonic Bonding Gold Wire

Bright Surface Finish Gold Wire

Semiconductor Packaging Gold Wire

Lugar de origen:

Porcelana

Nombre de la marca:

WINNER

Certificación:

ISO9100

Número de modelo:

MW001

Éntrenos en contacto con

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Detalles del producto

Aplicación:

Embalaje de semiconductores, microelectrónica, dispositivos médicos

Paquete:

Carrete

Resistencia a la corrosión:

Alto

Material:

Oro

Metros de longitud:

500/1000

Tipo de producto:

Alambre de unión

Revestimiento:

Oro

Método de unión:

Ultrasónico

Rango de temperatura:

-40 ° C a 200 ° C

Acabado superficial:

Brillante

Conductividad:

98%

Resaltar:

Ultrasonic Bonding Gold Wire

Bright Surface Finish Gold Wire

Semiconductor Packaging Gold Wire

Pago y términos de envío

Cantidad de orden mínima

1 unidad

Precio

999

Detalles de empaquetado

Rollo, embalaje neutrial o con logotipo OEM

Tiempo de entrega

5-8 días laborables

Condiciones de pago

LC, Unión Occidental, T/T

Capacidad de la fuente

100000 rollos por mes

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Descripción de producto

0.025MM/0.018MM 99.99 AU Wire Gold Bonding Wire

Product Specifications

Material	Gold
Diameter	0.0125, 0.05, etc. mm
Form	Wire
Purity	≥99.99%

Made from ultra-high purity gold (2N-4N), the Gold Bonding Wire is a key component in semiconductor assembly, providing excellent electrical conductivity for reliable connections. It is highly durable and resistant to corrosion, making it ideal for use in harsh environments. The wire is available in ultra-fine diameters ranging from 13 μm to 70 μm and in lengths from 100 meters to 500 meters. The ability to customize these specifications ensures flexibility for a wide range of applications, from advanced integrated circuits to microelectronic devices. Known for its exceptional mechanical properties and thermal conductivity, this bonding wire ensures stable, efficient, and long-lasting connections in high-performance devices.

Gold Wire Applications

Electronics and Semiconductors: Gold wire is extensively used in the electronics industry for bonding in semiconductor devices.
Electrical Contacts and Connectors: Due to its high conductivity and resistance to corrosion, gold wire is used in the manufacturing of electrical contacts and connectors.
Medical Devices: In medical devices, gold wire is used for its biocompatibility and conductive properties. It can be found in pacemakers, diagnostic equipment, and other implantable devices where reliable performance is crucial.