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High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics

High Conductivity Bonding Wire

High Bond Strength Gold Plated Silver Wire

Smooth Surface Finish Spooled Wire

Lugar de origen:

PORCELANA

Nombre de la marca:

WINNER

Certificación:

ISO9100

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Detalles del producto
Revestimiento:
Oro
Fuerza de enlace:
Alto
certificaciones:
ISO 9001
Resistencia a la corrosión:
Alto
Alargamiento:
3-20%
Tipo de producto:
Alambre de unión
Acabado superficial:
Liso, mate y texturizado
Diámetro:
0,7-1,0 mil
Material:
Oro, plata
Pureza:
99.99%
Resaltar:

High Conductivity Bonding Wire

,

High Bond Strength Gold Plated Silver Wire

,

Smooth Surface Finish Spooled Wire

Pago y términos de envío
Cantidad de orden mínima
1000 m
Precio
999
Detalles de empaquetado
Rollo, embalaje neutrial o con logotipo OEM
Tiempo de entrega
5-8 días
Condiciones de pago
T/T, D/A, Western Union
Capacidad de la fuente
99999999
Descripción de producto
High Conductivity Gold Plated Silver Wire on Spool
Factory Supply Ultra Fine Gold Plated Silver Wire
Gold Plated Silver Spooled Wire combines the high conductivity of silver with the corrosion resistance of gold, making it ideal for scientific research and laboratory use. This specialized wire is engineered for demanding applications where signal integrity must be maintained under extreme conditions.
Key Applications
  • Cryogenic systems and superconducting circuits
  • High-frequency RF and microwave assemblies
  • Quantum computing research
  • Particle detection systems
  • Photonics instrumentation
  • Materials science research
  • Aerospace testing applications
  • Precision engineering projects
  • Advanced sensor development
Product Advantages
  • Superior conductivity with low contact resistance
  • Excellent corrosion resistance from gold plating
  • Consistent signal transmission in extreme environments
  • Spooled format for precise handling in clean rooms
  • Ideal for research setups and laboratory applications
Product Images
High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 0 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 1 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 2 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 3 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 4 High Conductivity Gold Plated Silver Bonding Wire with High Bond Strength and Smooth Surface Finish for Microelectronics 5

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